Showing results: 211 - 225 of 237 items found.
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SVM II -
Attotech Co., Ltd.
Developed from Hexagon group’s leading vision technology, SVM series vision measuring machine perfectly combines traditional optical and latest computer image processing technology. Simple, accurate, versatile and effective, it is capable of basic element precision measurement on point, line, circle, etc., can accommodate batch measurement, has SPC functions, and is open for constant upgrade, with SVM series vision measuring machine’s powerful functions, reliable performance, continuously updated technology It is now widely applied in mechanical, electronics, house appliances, mold, optical and other precise hardware industries and can also be used for engineering development, drawing and production inspections, etc.,
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FastXe2 -
Alacron
The FastXe2 framegrabber series is for users who anticipate a demand for extreme I/O requirements and/or higher bandwidth, complex image processing and real-time high-speed storage in a cost effective platform. The base FastXe, is a one half length raw form factor PCIe (X4) Gen2 board with either six basic 85 MHz Camera Link Channels up to two extended full Camera Link camera interfaces. An auxilliary I/O connector provides a header for adaptation of other high speed interfaces such as GigEx4, high speed analog formats such as UXGA or DVI, or CoaXPress. The front-end data is formatted and preprocessed by a Kintex 7 FPGA before being sent to the PCIe (X4) Gen 2 bus
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NI
The Temperature Input Module for Remote I/O features a features a thermocouple input range of ±100 mV and a voltage input range of ±5 V. It also has an adjustable filter time for improved measurement quality and optional external CJC or PT100 RTD measurements.A remote I/O system consists of an EtherCAT bus coupler and individual modules mounted on a DIN rail. You control the Temperature Input Module for Remote I/O from a real‐time controller, such as a CompactRIO Controller or an Industrial Controller. You can use remote I/O hardware to add low‐cost I/O for simple tasks while your controller handles advanced tasks such as image processing, motion control, and high‐speed or specialty measurements.
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FastX-APU -
Alacron
The FastX-APU framegrabber series is for users who anticipate a demand for extreme I/O requirements and/or higher bandwidth, complex image processing and real-time high-speed storage in a cost effective platform. The base FastX-APU, is a two thirds length raw form factor PCIe (X4) Gen2 board with either six basic 85 MHz Camera Link Channels up to two extended full Camera Link camera interfaces. An auxilliary I/O connector provides a header for adaptation of other high speed interfaces such as GigEx4, high speed analog formats such as UXGA or DVI, or CoaXPress. The front-end data is formatted and preprocessed by a Kintex FPGA before being sent to the PCIe (X4) Gen 2 switch to the host or the AMD APU.
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IDS Imaging Development Systems GmbH
The functions of classic vision sensors - such as barcode readers - are usually strictly defined and hardly expandable. IDS NXT shows that there is a different way: the freely programmable platform is not tied to any predefined tasks. Instead, users can develop and install vision apps themselves and then change and set up various image processing tasks in a short time. App development does not require any additional specialist knowledge, because it hardly differs from the development of a "classic" industrial camera application. The possibility of installing different types of vision apps creates universal application possibilities in numerous application areas, for example in optical quality assurance, as an analytical device in medical technology, for surveillance tasks using face recognition or vehicle and person counting.
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Lepton -
Pure Engineering, llc
The FLIR Lepton™ is the most compact longwave infrared (LWIR) sensor available as an OEM product. It packs a resolution of 80 × 60 or 160x120 pixels into a camera body that is smaller than a dime. This revolutionary camera core is poised to equip a new generation of mobile and handheld devices, as well as small fixed-mount camera systems, with thermal imaging capabilities never seen before. Lepton contains a breakthrough lens fabricated in wafer form, along with a microbolometer focal plane array (FPA) and advanced thermal image processing. In order to support the lepton and make it easy to use, we have developed a breakout board to support the module along with example source code. Please see the Lepton Thermal Camera Breakout Datasheet for more information.
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Moritex Corp.
With many years of application experience and product development, our LED products offer the highest quality and best range of any manufacturer of machine vision lighting. The Constant Current Controlled "MG-Wave®" and Constant Voltage Controlled "CompaVis®" provides solutions for the diverse applications and image processing environments found in the industry. Unlike other companies that may focus only on lighting, our total system solutions approach provides customers with the best performance & efficiency through consideration of not just one but all three of the essential imaging fields: illumination, lens, and peripherals. Our total system solutions meet the needs of even the most challenging applications, especially with our ability to integrate hardware for advanced optical systems.
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FastX1703 -
Alacron
The FastX1703 framegrabber series is for users who anticipate a demand for extreme I/O requirements and/or higher bandwidth, complex image processing and real-time high-speed storage in a cost effective platform. The base FastX1703, is a two thirds length raw form factor PCI board six basic 85 MHz Camera Link Channels or an extended Camera Link camera interface. An auxilliary I/O connector provides a header for adaptation of other high speed interfaces such as LVDS or high speed analog formats such as UXGA or DVI. The front-end data is formatted and preprocessed by a FPGA before being sent to the memory subsection, up to four PNX1702 500 MHz processors with 256MB memory each. Finally, the FastX1703 interfaces to the host computer through a 4xPCIe interface for state-of-the-art data acquisition.
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FIB -
JEOL Ltd.
An easy-to-use, out-lens type scanning electron microscope (SEM) equipped with a Schottky electron gun, as well as a new FIB column capable of large current processing (maximum ion current 90nA) installed into one chamber. JIB-4610F enables high-resolution SEM observation after high-speed cross-section milling with FIB, and high-speed analysis with a variety of analytical instruments, such as energy dispersive X-ray spectroscopy (EDS) that takes advantage of the Schottky electron gun delivering a large probe current (200nA), electron back scatter diffraction (EBSD) to perform crystallographic characterization, and cathodoluminescence (CLD). In addition, the 3D analysis function Cut & See is included in the standard configuration, allowing cross-section milling to be executed automatically at fixed intervals, while acquiring SEM images for each cross section.
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1D-glass Thickness Profile Measuring Instrument GPM2 -
Optik Elektronik Gerätetechnik GmbH
Highly accurate automatic measurement of glass thickness distributions. The glass thickness profiler GPM has the function to execute a fast and precise determination of the thickness profile of flat glass samples or another transparent material with a thickness range from 30µm to 700µm (option with sensor type 1) and width to 1200mm. The measuring point distance of the profile measurement can be varied over a micro-step-controlled positioning steering between 0.1mm and 1mm. The measured value accommodation for a scanning point takes place with the help of a special hardware module for image processing algorithms within 40 ms. The entire measuring time for a sample results thus as product from the sample width which has to be measured, the measuring point distance and the measuring time per measuring point.
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NI
The Analog Output Module for Remote I/O features a 2-wire spring terminal connection, selectable output ranges (0 V to 10 V, ±10 V, 0 V to 5 V, ±5 V, 0 mA to 20 mA, 4 mA to 20 mA, and ±20 mA) output ranges, and short circuit proof outputs. A remote I/O system consists of an EtherCAT bus coupler and individual modules mounted on a DIN rail. You control the Analog Output Module for Remote I/O from a real‐time controller, such as a CompactRIO Controller or an Industrial Controller. You can use remote I/O hardware to add low‐cost I/O for simple tasks while your controller handles advanced tasks such as image processing, motion control, and high‐speed or specialty measurements.
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SUMIT360™ -
Teledyne FLIR
The SUMIT360™ provides military armored vehicle operators with an innovative, 360 degree view of the environment around the vehicle utilizing advanced sensor technology to improve threat and obstacle detection that could pose a threat to ground forces, and their mission. Equipped with powerful multi-spectral sensors in each module, the system uses on-board processing to form seamless, stitched images to provide a full field of view in any terrain, and virtually any conditions, day or night. With additional target detection and identification capability, the system can also be paired with advanced analytics and Artificial Intelligence (AI) to provide vehicle crew, and transported troops a threat detection and classification to provide critical decision support before opening the hatch. The system also provides the ability to support remote or optionally manned configurations.
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LEC-AL -
ADLINK Technology Inc.
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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784750-01 -
NI
4-Channel Thermocouple, 1-Channel Voltage, Temperature Input Module for Remote I/O - The REM‑11120 is a temperature input module for remote I/O. Remote I/O systems are low-cost, modular systems for simple machine control and measurements. A remote I/O system consists of an EtherCAT bus coupler and individual modules mounted on a DIN rail. You control the REM‑11120 from a real-time controller such as a CompactRIO Controller or an Industrial Controller. You can use remote I/O hardware to add low-cost I/O for simple tasks while your controller handles advanced tasks such as image processing, motion control, and high-speed or specialty measurements. The REM‑11120 also has an adjustable filter time for improved measurement quality and optional external cold junction compensation (CJC) or PT100 resistance temperature detector (RTD) measurements.
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784749-01 -
NI
4-Channel, 2-Wire Analog Output Module for Remote I/O - The REM‑11115 is an analog output module for remote I/O. Remote I/O systems are low-cost, modular systems for simple machine control and measurements. A remote I/O system consists of an EtherCAT bus coupler and individual modules mounted on a DIN rail. You control the REM‑11115 from a real-time controller, such as a CompactRIO Controller or an Industrial Controller. You can use remote I/O hardware to add low-cost I/O for simple tasks while your controller handles advanced tasks such as image processing, motion control, and high-speed or specialty measurements. You can use the REM‑11115 for voltage or current output, and it features a 2‑wire spring terminal connection method. The REM‑11115 has selectable output ranges and short-circuit-proof output channels.
